Technology
Fully Equipped
SMT Assembly Lines
Our facility operates fully equipped SMT assembly lines, designed for accuracy, flexibility, and consistent quality across prototype and production PCB assembly.
Jet Printing
Mycronic MY600
We use the Mycronic MY600 Jet Printer for high-precision, stencil-free solder paste application. Jet printing allows fast changeovers, precise deposition, and excellent performance for complex PCB designs, prototypes, and low-to-mid volume production.
Pick-and-Place
Mycronic MY300LX
& MY300DX
Component placement is handled by Mycronic MY300LX and Mycronic MY300DX pick-and-place machines. These high-speed SMT systems provide accurate component placement across a wide range of package types, supporting both fine-pitch and high-density PCB assemblies.
Selective Soldering
ACE KISS 101
For through-hole components, we use the ACE KISS 101 selective soldering system. This equipment ensures reliable, repeatable solder joints while protecting sensitive SMT components during the soldering process.
Automated Optical Inspection
Mirtec MV-6
OMNI 3D AOI
Every board is inspected using the Mirtec MV-6 OMNI 3D AOI system. Optical inspection detects solder defects, component misalignment, and other assembly issues early in the process to maintain high product quality.
X-Ray Inspection
YXLON Cheetah Evo
For hidden solder joints such as BGAs and QFNs, we utilize the YXLON Cheetah Evo X-ray inspection system. This allows detailed inspection of internal solder connections that cannot be verified by visual inspection alone.